China’s Semiconductor Leap: Xiaomi Unveils 3nm Chip Without EUV Technology

China’s semiconductor industry has taken a major leap forward, with Xiaomi successfully completing the tape-out of its first 3nm smartphone System-on-Chip (SoC), a development that was long considered out of reach due to U.S. sanctions. The announcement, made by Tang Jianguo during a broadcast on Beijing TV, signifies Xiaomi’s entry into the elite circle of companies capable of designing advanced 3nm chips. This achievement comes without the use of critical Extreme Ultraviolet (EUV) machines from ASML, the Dutch company whose exports to China have been restricted, forcing the country to develop its own production methods.

In a groundbreaking development for China’s semiconductor industry, Xiaomi has successfully completed the tape-out of the country’s first 3nm smartphone System-on-Chip (SoC), marking a significant milestone in the nation’s push for technological self-sufficiency. The announcement, made by Tang Jianguo during a Beijing TV broadcast, places Xiaomi among the select group of global tech companies capable of developing 3nm chips, a feat that was once thought to be at least a decade away due to stringent U.S. sanctions.

The achievement is particularly remarkable given the absence of Extreme Ultraviolet (EUV) lithography machines from ASML, the Dutch company that dominates the manufacturing of these vital tools for chip production. The U.S. had placed a ban on exporting these machines to China, limiting the country’s access to cutting-edge chipmaking technologies. This forced China to innovate domestically, and local foundry Semiconductor Manufacturing International Corporation (SMIC) played a crucial role in producing the 3nm chips.

This achievement follows Huawei’s earlier announcement that it had successfully developed its own 7nm chipset, another critical advancement for the Chinese tech sector. Xiaomi’s 3nm chips are expected to be featured in its upcoming smartphones and automobiles, signaling China’s rapid progress in catching up to the global semiconductor leaders. The ability to produce advanced chips locally is not just a technical success but a strategic one, positioning China to be more resilient in the face of ongoing trade restrictions.

The U.S. sanctions, which were designed to cripple China’s access to advanced semiconductors, instead accelerated the country’s efforts to innovate. With a population of over 1.4 billion and holding more technology patents than any other country, China had the resources and incentive to close the gap. The restrictions that once appeared to be a major setback have now become a catalyst for the nation’s rapid technological advancement.

China’s progress in semiconductor manufacturing has major implications for the global tech industry, as it demonstrates the country’s growing ability to operate independently of Western technologies. While the U.S. sanctions initially aimed to maintain a competitive edge by limiting China’s access to essential chipmaking equipment, the recent developments suggest that the global semiconductor landscape is shifting.